A surface-acoustic-wave die includes a generally rectangular die that comprises a piezoelectric material, atop which is positioned a surface-acoustic-wave electrode pattern. The pattern has a generally rectangular footprint, and the footprint has a top edge that is positioned at an acute, nonzero angle to a top end of the die. A pair of generally rectangular electrode pads are both in electrical contact with the electrode pattern, each pad adjacent diametrically opposed corners of the die. The device addresses the inefficiency in the conventional die layout technique, and provides a method for reducing the width of the die for SAW coupled resonator filters resulting in a smaller package.