The present invention is generally directed to various processes and
systems for forming layers and coatings on substrates, such as
semiconductor wafers and solar cells. In one embodiment, the process of
the present invention is directed to forming a layer on a substrate from a
liquid precursor. The liquid precursor is atomized and exposed to light
energy. Besides light energy, the parent material may also be exposed to
an electric field and/or to sonic energy. In an alternative embodiment of
the present invention a stress measurement device monitors stress in the
substrate as a layer is deposited on the substrate. This stress
measurement information is then sent to a controller for automatically
controlling the amount of energy, such as light energy being emitted onto
the substrate.