A laminated product is provided including a carrier sheet, a polymeric film ply, a polymeric card ply, and a radiation-curable laminating adhesive. The polymeric film ply is secured to the carrier sheet and extends over a cut-out portion formed in the carrier sheet. The polymeric card ply is positioned within the cut-out portion. Either the film ply, the card ply, or both, are transparent to electromagnetic radiation. The radiation-curable laminating adhesive is positioned to secure the polymeric card ply to the exposed ply portion and comprises a bonding agent, a monomer, an oligomer, a tackifier, and a photocatalyst. The bonding agent is present in a quantity sufficient to improve the bonding characteristics of the adhesive composition. The monomer is present in a quantity sufficient to (i) increase the flexibility of the adhesive composition, and (ii) increase the tendency of the adhesive composition to release substantially cleanly from a surface to which it is bonded. The oligomer is present in a quantity sufficient to increase the dimensional stability of the adhesive composition. The tackifier is present in a quantity sufficient to increase the uncured tack of the adhesive composition. The photocatalyst is present in a quantity sufficient to increase the tendency of the adhesive composition to cure upon exposure to electromagnetic radiation.