A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80.degree. C. to about 130.degree. C. Metal is plated on the seedlayer.

Um processo para chapear o metal em estruturas submicrónicas. Um seedlayer é depositado em superfícies de estruturas submicrónicas. O seedlayer é recozido em uma temperatura aproximadamente de 80.degree. C. aproximadamente a 130.degree. C. O metal é chapeado no seedlayer.
 
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