An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is provided with a plurality of connecting pads arranged around the opening of the receiving chamber. The chip is fixedly mounted in the receiving chamber and is provided with a plurality of connecting pads respectively electrically connected to the connecting pads of the substrate by means of bonding wires. The adhesive means is applied on the connecting area between the bonding wires and the connecting pads of the substrate. The cover is fixedly fastened to the adhesive means to close the opening of the receiving chamber.