A cover tape for packaging electronic elements capable of being heat-sealed
to a polycarbonate carrier tape having regularly formed pockets for
containing electronic elements, which cover tape comprises (A) a substrate
layer comprising a thermoplastic resin having a load deflection
temperature (ASTM D-648) under a load of 1.82 MPa of not lower than
60.degree. C., and (B) a heat seal layer comprising at least one resin
selected from polyvinyl chloride resin, polyester resin, polyurethane
resin, acrylic resin containing a functional group and ethylene copolymer
which have a Tg of 30-60.degree. C., and an electroconductive fine powder
dispersed in said resin.