An adhesive sheet for a semiconductor connecting substrate consisting of a
laminate having an adhesive layer on a substrate, wherein said adhesive
layer contains a thermoplastic resin (A) and an epoxy resin (B) and said
epoxy resin (B) contains at least one epoxy resin (B) selected from (I)
dicyclopentadiene skeleton-containing epoxy resins, (II) terpene
skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing
epoxy resins, as an essential component; an adhesive-backed tape for TAB
consisting of a laminate having an adhesive layer and a protective film
layer on a flexible organic insulating film. The adhesive sheet for a
semiconductor connecting substrate, the adhesive-backed tape for TAB and
the adhesive-backed tape for wire bonding connection of the present
invention are excellent in adhesive strength, insulatability, dimensional
accuracy, etc., and can improve the reliability of a semiconductor
integrated circuit connecting substrate and a semiconductor device
respectively for high density packaging.
