A room temperature curable organopolysiloxane composition comprising (a) an
organopolysiloxane having a specific structure, (b) a alkenoxysilane or
substituted alkenoxysilane or a partial hydrolyzate thereof, and (c) a
siloxane or a partial hydrolyzate thereof cures into a product which
experiences no decline of insulation resistance upon application of
voltage in a hot humid environment and is resistant to electrolytic
corrosion.
