A multichip mounted structure has a substrate 11 provided with
substrate-side terminals 16a and 16b and a plurality of IC chips 12a and
12b provided with bumps 14a and 14b, respectively, so that the
substrate-side terminals 16a and 16b are conductively connected with the
bumps 14a and 14b, respectively. The bumps 14a and 14b provided on the
plurality of IC chips 12a and 12b, respectively, form pairs of terminal
lines opposing each other. Since the plurality of IC chips 12a and 12b are
mounted on the substrate 11 so that central lines L1 and L2 between the
pairs of terminal lines which are individually formed approximately
coincide with each other, it is not necessary to transport a position of a
compressive head, and one piece of ACF 19 can be commonly used.
