An intermediate base supports a semiconductor module on a printed circuit
board. The intermediate base has an upper face on which the semiconductor
component is directly mounted with its component connecting elements
facing the upper face. The base has through-holes which are incorporated
from a lower face of the base body so that the component conducting
elements of the semiconductor component are exposed. The through-holes are
then at least partially coated with a metal layer, which also contacts the
exposed portions of the component connecting elements. Each of the
through-holes has at least a partially annular notch, so that each
through-hole extends through a recessed stud, which is used to form an
external connection for the module onto the printed circuit board.
