A test probe for a high-frequency device having an electronic circuit with
two or more contact regions. The test probe comprises two or more signal
probe tips. Each signal probe tip has a contact surface area for
contacting one of the contact regions of the device. A ground probe has a
ground contact surface with a surface area substantially greater than the
contact surface area of the one signal probe tip for contacting another
one of the contact regions of the electronic circuit. The ground probe is
positioned between at least two of the signal probes.
