The invention relates with an optical bench for optoelectronic packages comprising
a rigid insulating substrate, the substrate having a top surface along which it
is defined an optical axis, the substrate comprising: a device region for mounting
at least an optoelectronic device in alignment with the optical axis, and a fixing
region adjacent to the device region for affixing at least an optical component
in alignment with the optical axis. The substrate further comprises a third region
provided with metallised tracks, the third region extending over the substrate
top surface along at least part of one side of the fixing region in a direction
substantially parallel to the optical axis. The invention also relates with an
optical bench comprising: a single baseplate having a device region and a fixing
region; a welding platform mounted directly on said fixing region; a heat sink
mounted directly on said device region; and an optoelectronic device directly mounted
on said heat sink.
