A semiconductor device includes a semiconductor chip and a printed circuit
board. Metal electrodes of the semiconductor chip and the internal
connection terminals of the printed circuit board are electrically
connected through the metallic joining via precious metal bumps. A melting
point of a metal material constituting each of the metallic joining parts
is equal to or higher than 275 degrees, and a space defined between the
chip and the board is filled with resin (under fill) containing 50 vol %
or more inorganic fillers.
