An integrated inductor may be formed over a substrate. An aperture may be
formed by a backside etch through the semiconductor substrate underneath
the integrated inductor. The aperture may then be filled with a dielectric
material. As a result of the removal of the underlying substrate material,
magnetic and capacitive coupling of the inductor to the substrate may be
reduced. In addition, in some cases, the presence of the dielectric may
facilitate attachment of the resulting die to a leadframe and package
without degrading the inductor's performance and may provide better
structural support.
