A transducing head formed upon a slider has a transducer, an electrical
contact layer, a stud electrically connected to the contact layer, and a
bond pad electrically connected to the stud. The electrical contact layer
is electrically connected to the transducer. The stud is formed of a
material having a coefficient of thermal expansion less than about 1.3
times a coefficient of thermal expansion of a slider material forming the
slider. The bond pad has a metallic underlayer and a top layer. The
metallic underlayer is formed of a material having a coefficient of
thermal expansion less than about 1.1 times the coefficient of thermal
expansion of the slider material.
