Electronic part

   
   

An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm.sup.2 /g.

Un componente electrónico incluye un elemento electrónico y un substrato a los cuales se monte el elemento electrónico, el elemento electrónico y el substrato eléctricamente o mecánicamente conectando el uno al otro por por lo menos tres topetones. Ambo el valor obtenido dividiendo el vinculacio'n-a'rea total de los topetones enlazados al elemento electrónico por la masa del elemento electrónico y el valor obtenido dividiendo el vinculacio'n-a'rea total de los topetones enlazados al substrato por la masa del elemento electrónico son por lo menos cerca de 8.8 mm.sup.2 /g.

 
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