The present invention provides a small-sized and inexpensive semiconductor
device wherein a synchronous dynamic random access memory and a flash
memory are built in a single encapsulater. A flash memory chip and a
synchronous dynamic random access memory chip (SDRAM chip) are fixed to a
main surface of a wiring board in a parallel state, and another SDRAM chip
is fixed onto the flash memory chip. Electrodes for the respective
semiconductor chips are respectively exposed and these electrodes are
connected to their corresponding electrodes of the wiring board. An
encapsulater formed of an insulating resin is formed on the main surface
side of the wiring board so as to cover wires. Since the encapsulater is
formed by cutting a block encapsulater formed by block molding by dicing,
the side faces of the encapsulater result in cut surfaces. Bump electrodes
are provided on the back surface of the wiring board in an array fashion.
