A method and apparatus for measuring a target constituent of an
electroplating solution using an electroanalytical technique is set forth.
In accordance with the method, at least two electrodes are employed to
execute the electroanalytical technique. Gasses that are trapped or
generated at the surface of one or both of the electrodes of the pair are
reduced and/or removed by directing a flow of solution toward the
electrode surface. This flow of solution against the electrode surface
acts to automatically flush the generated gasses (typically in the form of
small bubbles) from the electrode surface and generally eliminates the
need for manual purging by an operator. Elimination of these gasses
reduces or eliminates variability in the open circuit potential, and
concomitant noise that would otherwise occur in the electroanalytical
measurements.
