The subject of the disclosed art is to prevent a short circuit between
plural electrodes caused by soldering in the assembling process for a
semiconductor laser element. The constitution for improving the subject is
as follows. A semiconductor laser device comprises a semiconductor laser
chip having a first electrode and a laser sustaining material, in which
the laser sustaining material has electrodes and solder layers connected
electrically therewith on the surface where the semiconductor laser chip
is mounted, the first electrode of the semiconductor laser chip is
connected with the solder layer of the laser sustaining material and at
least the solder layer of the laser sustaining material extends from at
least one end face in the longitudinal direction of an optical resonator
of the semiconductor laser chip to the outside of the optical resonator.
