A vertically integrated structure includes a micro-electromechanical system
(MEMS) and a chip for delivering signals to the MEMS. The MEMS has an
anchor portion having a conductor therethrough, by which it is connected
to a substrate. The chip is attached to the MEMS substrate in a direction
normal to the substrate surface, so as to make a conductive path from the
chip to the MEMS. The chip may be attached by bonding the conductor to C4
metal pads formed on the chip, or by bonding the conductor to metal studs
on the chip. The MEMS substrate may be thinned before attachment to the
chip, or may be removed from the underside of the MEMS. A temporary
carrier plate is used to facilitate handling of the MEMS and alignment to
the chip.
