A modular semiconductor chip cooling system having a readily openable
enclosure defining a chamber configured to hold a printed circuit board
carrying components to be cooled. The enclosure can include a reservoir, a
condenser and a pump. Sprayers within the chamber are adjustably mounted
on one or more brackets to allow each sprayer to be set for the individual
height of its respective component. The enclosure can be readily removed
from a computer system through a quick release connection. The computer
system can include a condenser and pump to operate all its modular cooling
systems, removing the condensing function from the individual modules.
