A thermal interface pad is constructed from a plurality of thermal interface
plate
assemblies. Alternate thermal interface plate assemblies are rotated about 180
degrees from each other within the pad. Each plate assembly includes one or more
spring members configured such that the completed thermal interface pad includes
a plurality of spring members on at least two sides of the pad. The thermal interface
plate assemblies are configured to allow the thermal interface pad to vary greatly
in thickness. The pad is sufficiently adjustable in thickness to accommodate gross
tolerance differences between multiple heat generating and sinking devices. Rods
inserted in openings in the plates may be used to align the plate assemblies and
to apply compressive force to the plates, improving the thermal conductivity between
adjacent plates and greatly decreasing the overall thermal resistance of the thermal
interface pad.
