A cooling solution is provided for a modular data center. The modular data
center includes a plurality of racks, each of the racks having a front
face and a back face, wherein the plurality of racks is arranged in a
first row and a second row, such that the back faces of racks of the first
row are facing the second row, and the back faces of the racks of the
second row are facing the first row, a first end panel coupled between a
first rack of the first row and a first rack of the second row, the first
end panel having a bottom edge and a tope edge, a second end panel coupled
between a second rack of the first row and a second rack of the second
row, the second end panel having a top edge and a bottom edge, and a roof
panel coupled between the top edge of the first panel and the top edge of
the second panel. Cooling equipment within at least one of the equipment
racks draws hot air from between the rows of racks and delivers cooled air
out of the front face of one of the racks.
