A two component, curable hot melt adhesive system includes a first hot melt
adhesive formulation which has a softening temperature greater than room
temperature and which includes a first component of a curable adhesive
therein. The system includes a second hot melt adhesive formulation which
has a softening temperature which is greater than room temperature and
which includes a second component of a curable adhesive therein. The
second component is reactive with the first component to provide a cured
adhesive bond. In use, the two formulations are heated to a temperature
above their softening temperature and are contacted so as to cause mixing.
The mixture cools to provide a thermoplastic bond which subsequently cures
to provide a permanent adhesive bond. While the first and the second
component individually perform as hot melt adhesives, combining the first
and the second gives enhanced adhesive performance in extended temperature
ranges.
