An exposure method of drawing a pattern on a substrate using a charged
particle beam. The method includes a detection step of placing a
calibration substrate having a plurality of marks on a stage and detecting
positions of the plurality of marks by a first position detection section
using a charged particle beam and by a second position detection section
using light while adjusting a position of the stage, and a correction step
of correcting a position where the charged particle beam is incident on
the substrate on which the pattern is to be drawn in drawing, in
accordance with the position of the stage on the basis of the difference
between detection results by the charged particle beam and the light in
the detection step.
