An optoelectronic assembly includes a transistor outline (TO) package that
houses an optoelectronic device. The TO package and the optoelectronic
device are coupled to a circuit interconnect. The circuit interconnect
includes an insulator having a first side for transmitting a signal
current between the optoelectronic device and a device external to the TO
package, and a second side for transmitting a ground current between the
TO package and the external device. For a predefined operating frequency
range, the impedance of the circuit interconnect approximately matches the
impedance of the signal leads of the TO package and also approximately
matches the impedance of the device external to the TO package. The
optoelectronic device may include a laser diode or a photo diode. In
addition, the present invention is an optoelectronic transceiver including
a transmitter optoelectronic assembly and a receiver optoelectronic
assembly. The transmitter optoelectronic assembly includes a transmitter
TO package and a transmitter circuit interconnect, and the receiver
optoelectronic assembly includes a receiver TO package and a receiver
circuit interconnect.
