Epoxy resin compositions are disclosed which comprise (A) at least one
cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C)
at least one a boron containing catalyst that is essentially free of
halogen, (D) at least one cure modifier, and, optionally (E) at least one
ancillary curing catalyst. The encapsulant may also optionally comprise at
least one of thermal stabilizers, UV stabilizers, coupling agents, or
refractive index modifiers. Also disclosed are packaged solid state
devices comprising a package, a chip, and an encapsulant comprising an
epoxy resin composition of the invention. A method of encapsulating a
solid state device is also provided.
