A downset edge integrated heat spreader is disclosed. The downset edge can
be formed to an industrially accepted flatness with a single stamping
operation. The downset edge can provide a surface for fastening the
downset edge integrated heat spreader to a mounting substrate. The downset
edge can also provide a component recess for mounting a component near a
processor, but on the mounting substrate. The downset edge can also
provide a warp and bend resistant structure during ordinary field use.
