An organic semiconductor device is provided. The device has a first electrode
and a second electrode, with an organic semiconductor layer disposed between the
first and second electrodes. An electrically conductive grid is disposed within
the organic semiconductor layer, which has openings in which the organic semiconductor
layer is present. At least one insulating layer is disposed adjacent to the electrically
conductive grid, preferably such that the electrically conductive grid is completely
separated from the organic semiconductor layer by the insulating layer. Methods
of fabricating the device, and the electrically conductive grid in particular,
are also provided. In one method, openings are formed in an electrically conductive
layer with a patterned die, which is then removed. In another method, an electrically
conductive layer and a first insulating layer are etched through the mask to expose
portions of a first electrode. In yet another method, a patterned die is pressed
into a first organic semiconductor layer to create texture in the surface of the
first organic semiconductor layer, and then removed. An electrically conductive
material is then deposited onto the first organic semiconductor layer from an angle
to form a grid having openings as a result of the textured surface and the angular
deposition. In each of the methods, insulating layers are preferably deposited
or otherwise formed during the process to completely separate the electrically
conductive layer from previously and subsequently deposited organic semiconductor layers.
