A semiconductor laser device includes a semiconductor laser element, a lead having
an element disposing section where elements are disposed and a resin bonded to
the lead. The lead has a thick portion and a thin portion with the thick portion
being formed to extend at least in the direction of the width of the resin to cover
a region having a length equal to or greater then the width of the resin. A semiconductor
laser device has a semiconductor laser element, a lead having an element mount
portion on which the semiconductor laser element is mounted and a resin maintained
in intimate contact with the lead. The lead has a thicker portion and a thinner
portion. The thicker portion is formed to extend in the direction of the width
of the resin over a width equal to or greater than the width of the resin.
