An electronic apparatus includes a case mounting a semiconductor element within
an inside thereof, a heat-receiving member thermally connected with the semiconductor
element, a heat-radiation member disposed on an inner side surface of the casing,
and a liquid driver for driving a liquid coolant between the heat-radiation member
and the heat-receiving member. The apparatus further includes a tank accumulating
the liquid coolant therein with at least a predetermined volume of the coolant
to delimit a coolant surface within the tank, wherein the tank, the heat-radiation
member and the heat-receiving member are connected with tubes, and a suction end
portion of a suction pipe connected into the tank is located at a position which
is always below the coolant surface irrespective of change of position of the tank.
