The present invention relates to a method and apparatus that prevents/minimizes
cracking in the ceramic body of processors. The ability to prevent/minimize cracking
can ensure successful operation and substantially increase processor lifetime.
The present invention discloses a device for maintaining a microprocessor in a
desired relationship with a printed wiring board while limiting the transmission
of shock and vibrational motion to and from the processor includes a printed wiring
board, a processor, and a dynamic isolating mount compressed between the printed
wiring board and the processor, wherein the processor maintains the dynamic isolating
mount in a compressed state such that the dynamic isolating mount bears on the
printed wiring board.
