A dual-layer heat dissipating structure includes a first heat sink, a second
heat
sink, and a heat pipe with a connecting portion and a curved portion, interconnecting
the first and second heat sinks for thermal conduction. The first and second heat
sinks each has a substrate and exterior fins protruding from two opposing ends
thereof. Two substrates each includes at least one slot through out of two corresponding
end plates of the same side for locating the connecting portion, and the corresponding
end plates each includes an opening with respect to the slot for partially moving
in the curved portion. The exterior fins of the first and second heat sinks are
aligned with each other, and a snap-type connecting structures are formed on terminuses
of the exterior fins. The second and first heat sinks are connected to each other
by the snap-type structure, and the connection joint is reinforced by implanting
soldering material.
