Semiconductor process yield analysis in which the relationship between
a wafer-level parameter and a die-level parameter is evaluated can be performed
more quickly and with greater accuracy than has been the case with previous such
yield analysis. The yield analysis can be performed by selecting regions of a semiconductor
wafer or wafers from which parametric data is to be obtained for use in the analysis,
based on one or more characteristics of the wafer(s). The yield analysis can be
performed by grouping the parametric data based on both a grouping of the wafer-level
parametric data and a grouping of the die-level parametric data. The yield analysis
can be performed by grouping the parametric data in greater than 3 groups.
