A method of increasing the conductivity of a transparent conductive layer, in
which
a photoresist layer which patterns the transparent layer is given tapered edges
and is partially etched. The partial etching exposing the edge regions of the underlying
transparent conductor layer, which are the selectively plated. This method has
a single patterning stage of the transparent layer, but uses partial etching of
a tapered resist layer in order to expose a small edge region of the transparent
layer for coating with a conductive layer (which can be opaque).
