A semiconductor device is formed from a die and a lead frame having one or more
bus bars. Portions of the bus bars are overlain with an electrically insulative
material while leaving bonding areas unobstructed, whereby bond wires which span
the bus bar(s) may be bonded with a shorter wire and a lower loop, without the
danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the
encapsulation step is also reduced.
