Microelectronic packages include a first microelectronic substrate
having a first face and a first AC-coupled interconnect element on the first face.
A second microelectronic substrate includes a second face and a second AC-coupled
interconnect element on the second face. A buried solder bump extends between the
first and second faces, and is at least partially buried beneath the first and/or
second faces, to maintain the first and second AC-coupled interconnect elements
in closely spaced apart relation. The buried solder bump also may couple DC power
between the first and second substrates. Other technologies also may be used to
maintain the AC-coupled interconnect elements in closely spaced apart relation
and to couple DC power between the substrates. The first and second AC-coupled
interconnect elements may be first and second capacitor plates, first and second
inductors and/or first and second combined inductive and capacitive elements.
