A method for fabricating a cladded conductor (42) for use in a magnetoelectronics
device is provided. The method includes providing a substrate (10) and forming
a conductive barrier layer (12) overlying the substrate (10). A dielectric
layer (16) is formed overlying the conductive barrier layer (12)
and a conducting line (20) is formed within a portion of the dielectric
layer (16). The dielectric layer (16) is removed and a flux concentrator
(30) is formed overlying the conducting line (20).