A multi-layer printed circuit board on which insulation resin layers and circuit
pattern layers are alternatively stacked to form multiple layers, including: an
insulation resin layer; a circuit pattern formed at the upper surface of the insulation
resin layer; a blind via hole formed penetrating the insulation resin layer and
the circuit pattern; a plated layer formed at the upper surface of the circuit
pattern, at the inner wall face and the bottom of the blind via hole; an inner
lead bump pad formed at the surface of the plated layer which is exposed to the
lower surface of the insulation resin layer; and an outer lead bump pad formed
on the circuit pattern which is formed at the upper surface of the insulation resin
layer, whereby the problem of defective attachment of a bump due to a void present
in a blind via hole is eliminated.
