A method (400) for determining a response to a wafer manufacturing process
problem includes the steps of generating a wafer map signature (406) containing
defect attributes to be identified and retrieving (410) one or more wafer
map signatures from a database. The wafer map signature to be identified is matched
(414) with the one or more wafer map signatures from the database in order
to help find a root cause of a defect in a wafer manufacturing process.
This provides at least the advantage that a signature matching capability allows
an Operator to more accurately identify a root manufacturing cause of a wafer defect.
Furthermore, instant feedback to the wafer manufacturing process can be provided
to facilitate rapid correction of manufacturing errors.
