One aspect of the present invention relates to copper-catalyzed carbon-heteroatom
and carbon-carbon bond-forming methods. In certain embodiments, the present invention
relates to copper-catalyzed methods of forming a carbon-sulfur bond between the
sulfur atom of a thiol moiety and the activated carbon of an aryl, heteroaryl,
or vinyl halide or sulfonate. In other embodiments, the present invention relates
to copper(II)-catalyzed methods of forming a carbon-nitrogen bond between the nitrogen
atom of an amide and the activated carbon of an aryl, heteroaryl, or vinyl halide
or sulfonate. In certain embodiments, the present invention relates to copper-catalyzed
methods of forming a carbon-carbon bond between the carbon atom of cyanide ion
and the activated carbon of an aryl, heteroaryl, or vinyl halide or sulfonate.
In another embodiment, the present invention relates to a copper-catalyzed method
of transforming an aryl, heteroaryl, or vinyl chloride or bromide into the corresponding
aryl, heteroaryl, or vinyl iodide. Yet another embodient of the present invention
relates to a tandem method, which may be practiced in a single reaction vessel,
wherein the first step of the method involves the copper-catalyzed formation of
an aryl, heteroaryl, or vinyl iodide from the corresponding aryl, heteroaryl, or
vinyl chloride or bromide; and the second step of the method involves the copper-catalyzed
formation of an aryl, heteroaryl, or vinyl nitrile, amide or sulfide from the aryl,
heteroaryl, or vinyl iodide formed in the first step.
