Methods and apparatuses for transferring heat from microelectronic device
modules are disclosed. An apparatus in accordance with one embodiment of the invention
can include first and second heat transfer portions positioned to face toward opposing
faces of a microelectronic device module. Heat transfer fins having different length
can extend away from at least one of the heat transfer portions. In one embodiment,
the heat transfer fins can be integrally formed with other portions of the apparatus.
In other embodiments, modules carrying the heat transfer devices can be mounted
at an acute angle relative to a support structure (such as a PCB) so that heat
transfer fins from one module can extend adjacent to the end region of the neighboring
module. This arrangement can increase the rate at which heat is transferred away
from the modules, and can increase the utilization of a limited heat transfer volume
within a device, such as a computer.
