An electronic assembly includes an integrated circuit (e.g., a processor) mounted
on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled
to the integrated circuit. The radial heat sink includes a core having an outer
surface, and a plurality of helical fins that extend from the outer surface of
the core. The electronic assembly may include a fan positioned near the heat sink.
The appropriate angle for the helical fins relative to the longitudinal axis of
the heat sink depends in part on the direction of the airflow that is produced
by the fan.
