The present invention discloses a net-shape molded elastomeric heat-dissipating
device that includes an integrally formed conformable interface surface. A base
elastomeric matrix material is loaded with thermally conductive filler and injected
into a mold cavity to form the completed device. Further, a layer of thermally
conductive pressure sensitive adhesive material is applied to the conformable interface
surface to allow the device to be securely fastened to a heat-generating surface.
The present invention provides superior sealing and elimination of voids and air
gaps that are typically found between the thermal transfer surfaces thereby facilitating
enhanced thermal transfer properties. In addition, the present invention provides
a method of manufacturing an elastomeric heat sink device as described above.
