A process for providing one or more protected copper elements on a surface of
a
workpiece is set forth. In accordance with the process, a barrier layer is applied
to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent
electroplating processes, a separate seed layer is applied over the surface of
the barrier layer. One or more copper elements are then electroplated on selected
portions of the seed layer or, if suitable, the barrier layer. If used, the seed
layer is then substantially removed. At least a portion of a surface of the barrier
layer is rendered unplatable while leaving the copper elements suitable for electroplating.
A protective layer is then electroplated onto surfaces of the one or more copper elements.
