An electronic component includes a semiconductor chip which has an active upper
side and a passive rear side. The semiconductor chip is surrounded by a sawn edge.
This edge of semiconductor material has profile-sawn contours. The profile-sawn
contours are surrounded by a plastics composition forming an edge of plastic. The
plastics composition is in form-locking engagement with the profile-sawn contours.
A method of producing a component of this type is also provided.
