A porous adhesive sheet 1 having plural through holes 2 running
in
about parallel with each other in the thickness direction A of an adhesive organic
film 3, wherein the through holes have about congruent sections in the diameter
direction from one opening 2a to the other opening 2b and
a production method thereof, and a semiconductor wafer with a porous adhesive sheet
31, which includes a semiconductor wafer 32 having an electrode 33,
the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive
part 34 formed by filling a through hole 2 located on the electrode
33 with a conductive material, and a production method thereof are provided.
