The present invention provides a manufacturing method of an electronic circuit
device including a multi-layer circuit board incorporated with a thin film capacitor
small in size and of high performance capable of attaining higher capacitance value
with a thin dielectric film of high dielectric constant and with favorable film
quality. A first electrode layer and a thin film dielectric layer are laminated
continuously in this order in one identical to laminate each of the layers on a
leveled substrate in one identical chamber and then the first electrode layer is
fabricated a conductor pattern.
