A power monitoring arrangement for semiconductor light emitting devices used
in
optoelectronic packages includes a mounting structure, a light emitting device,
and a monitor photodetector. The mounting structure has a mounting surface with
the light emitting device and the monitor photodetector positioned thereon. The
light emitting device provides emitted light at a monitoring output and an active
output. The monitor photodetector has a light sensitive region and is positioned
on the mounting surface of the mounting structure proximate the monitoring output
of the light emitting device. A hemisphere of material is formed to include at
least the light sensitive region of the monitor photodetector and the monitoring
output of the light emitting device. An outer surface of the hemisphere operates
as a reflecting surface to reflect light from the monitoring output of the light
emitting device to the light sensitive region of the monitor photodetector.
