A semiconductor device formed by cutting a first substrate and a second substrate
bonded together by a spacer, wherein: the spacer is disposed at an end of the first
substrate after cutting; the second substrate is a semiconductor wafer formed with
a light reception element or elements; and the first substrate has an optical element
or an optical element set for converging light on the light reception element or
elements. A method of manufacturing such a semiconductor device. A semiconductor
device manufacture method includes: a step of detecting a warp of a semiconductor
substrate; a step of holding the semiconductor substrate on a base under a condition
that the warp is removed; a step of bonding an opposing substrate to the semiconductor
substrate; and a step of cutting the opposing substrate, wherein the opposing substrate
bonded to the semiconductor substrate is set with a size corresponding to the warp
of the semiconductor substrate or with a gap to an adjacent opposing substrate.
